Dual Flagship DAC chipset
ROHM BD34301EKV x 2

The digital audio circuit is designed around two ROHM BD34301EKV chipsets. 
It is the first time for the chipset to be implemented in a porable player and 
each chip is operated in mono mode which maximises its performance.

Two low-pass antialiasing filters (PCM mode) and three DSD Filters are 
available to fine tune sound signature. 

The digital audio circuit around two flagship chipsets also features,

2 Femtosecond Crystal Oscillators
with extremely low phase noise (-100dBc) to ensure high precision low jitter 
digital playback.

2x2 Current to Voltage I-V Converter Network
as low noise high current output stage of the ROHM DACs.

6-layer PCB
enhanced signal isolation for lower the background noise and 
interference to critical components such as oscillators.

Dual Vacuum Tube
Available for Single-ended and Balanced Phone Out

Fully balanced vacuum tube timbre circuit through two pieces of KORG 
Nutube 6P1 Double Triode. Both Nutubes are rigorously tested and 
matched before installation.

Delivers smooth and sentimental musical through 3.5mm single-ended 
or 4.4mm balanced headphone output.

Zero Gain Negative Feedback Loop circuit delivers strong current and 
impressive handling at difficult load. The transparent, transient and 
extension that rival the best solid state circuit but remain warm, 
smooth and involving.

Innovative Suspension Installation
Exclusively designed system to minimize mechanical shock and vibration to eliminate microphonic effect of the Nutubes.

Compartmentalized 
CNC Aluminum Chassis 
to create an isolated, fully damped chamber for Nutube installation.

Flexible Printed Circuit
to minimize shock transmission to and from main PCB.

In-house designed
Shock-absorption Silicon Housing
to hold and shield the Nutubes.

Suspension Pin
to mount the Nutube and Silicon Housing into the designated 
chamber securely.

Dual Output Mode
P (Standard) ¦ P+ (High Output)

Regulate the operational voltage of 
headphone amplification circuit to offer 
two distinctive outputs.

P+ will increase output and handling power with 
a more saturated sound signature. Single-ended Phone out: 720mW (16Ω) 
Balanced Phone out: 1200mW (16Ω)

Dual Amp. Operation Mode
Class A ¦ Class AB

The Dual Amplifier Operation Mode allows
you to switch between Class A and Class AB 
modes instantly through the pull down menu. 

Choose the sound signature to fit your personal 
preference of sound, music genres, and/or
matching with different IEM/headphones.

Fully Discrete HeadAmp
Uncompromised Design

4-channels discrete circuit with Low-noise audio grade JFET 
(Junction gate Field-Effect Transistor) and BJT (Bipolar Junction Transistor). 

Going discrete allows more room to fine tune sound signature and
deliver superior performance over op-amp based design.

Uncompromised Implementation

To maintain all channels at almost identical gain for Class A amplification, 
we matched critical components and installed them to the PCB manually 
before reflow soldering. 

Dual Line Out

Both 3.5mm single-ended and 4.4mm balanced line out
bypass the headphone amplification circuit completely.

With that, N8ii can serves as a high-quality analogue source 
for active speakers and portable/desktop amplifiers.

Desktop grade implementation, fits for amplifiers with
high input impedance.

Maximum compatibility with configurable output levels.
•  3.5mm: 2.0V (High), 1.5V (Mid), 1.0V (Low)
•  4.4mm: 4.0V (High), 3.0V (Mid), 2.0V (Low)

Interface Madness
Comprehensive choice of inputs and outputs

Phone Output: 
3.5mm Single-ended 
4.4mm Balanced

Unamplified Line Output: 
3.5mm Single-ended (dedicated) 
4.4mm Balanced (shared with phone, swtich in pull down menu)

Digital Interface: 
USB Audio Transport (USB-C, Output)          I2S (Mini HDMI, Output) 
USB Audio DAC (USB-C, Input)                     S/PDIF Coaxial (Embedded USB-C, Output)

Bluetooth v5.0 
Codec supported: LDAC, AAC, UAT, UAT TWS, SBC 
(supports both transmit and receive applications)

Optimum Thermal Structure

N8ii features a special designed thermal structure which
allows the device to stay in appropriate temperature even 
in long-term usage. 
The nickel silver plate and graphite sheet attached to core 
components transfer heat to the CNC machined internal 
aluminum frame which works as a heat sink to direct the 
heat to all the edges simutaneously.

The structure maximizes the thermal efficiency and ensures 
the device to maintain its best performance.